[ IR Wafer 2 inspection machine ]

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Machine Spec
  • Capacity600EA/hrs (3.8x3.8mm)
  • Wafer Size12" & 8"
After Saw Inspection Function
  • Auto load and unload
  • Auto Read Barcode
  • Auto Focus Function
  • Auto Alignment Function
  • X.Y.Z.θ Table
  • Marble Terrace
  • Air Shockproof Mechanism
  • Resolution1~3um/Pixel
  • Min. Defect > 5X5 Pixel & Gray Level > 30
  • Auto Alignment & Auto Correction Die
  • OutputAuto Merge Map File
  • Vision Inspection Function
  • Sidewall Chipping Around The Die
Inspection Area Function

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