[ WAFER MAP OCR ]

  • 首頁
  • > 產品介紹 >WAFER MAP OCR
Specification
  • Wafer Size8,12 inch
  • Minimum die size0.5mmX0.5mm
  • Automatic Alignment
  • Auto Merge Map File
Inspection Function
  • Compares MAP File to Wafer to Detect Anomaly
  • Map with Anomaly will not Flow to Client Computer
  • Replaces Human Eye Inspection of Map, Accelerating Pace of Production
  • Easily Accessible Inspection Records and Pictures
  • SECS Communication Protocol
  • MAP File Automatically Loaded with Parameters
Map Comparison Machine (Manual):
H/W SPEC&Capability:
S/W Capabilities:
Die Size(limitation):0.7x0.7mm
Wafer size adjusting available
Wafer size:4,6,8,12"
Fail message deletable
32"LCD Panel with scratch proof cover
Double confirm configuration
IPC One Complete set
 

 

 

 

Back